Key Takeaways
Since Intel announced plans to expand its semiconductor foundry business in 2021, the firm has pushed tens of billions of dollars into developing new manufacturing processes and facilities.
Dubbed Integrated Device Manufacturing (IDM) 2.0, the initiative has been a significant drag on Intel’s bottom line. And with takeover rumors swirling, its future looks uncertain.
Nevertheless, there are signs that the strategy is starting to pay off.
A key component of IDM2.0 is Intel’s 18A process node, a semiconductor manufacturing process that aims to increase chip density and performance per watt.
During Intel’s Direct Connect conference on Tuesday, April 29, CEO Lip-Bu Tan confirmed that the firm is still committed to its foundry ambitions.
When asked whether Intel would continue to focus on contract manufacturing under his leadership, he said: “The answer is yes.”
“I’m committed to (making) the Intel foundry successful,” he added.
Meanwhile, Intel Foundry’s chief technical officer, Naga Chandrasekaran, announced that the firm planned to offer high-volume production on the 18A process toward the second half of 2025.
In March, Reuters reported that Nvidia and Broadcom have started running 18A manufacturing tests.
In September 2024 the company signed a multi-year, multi-billion-dollar agreement with Amazon Web Services (AWS) that will see Intel produce custom AI chips for AWS data centers.
Intel will produce an AI fabric chip for AWS using its 18A process node as part of the deal. It will also build on an existing contract for 3nm node chips, designing a new Xeon 6 processor specifically for Amazon data centers.
While AWS deploys a range of different processors in its data centers, its in-house offering is increasingly capable and has helped the firm reduce its reliance on external suppliers in recent years.
Amazon is Intel’s second major client for the new 18A process. In February 2024, Microsoft CEO Satya Nadella revealed that the company uses Intel’s manufacturing capacity to install new chips in its data centers.
With Microsoft and AWS now signed on as customers and Nvidia and Broadcom experimenting with the new technology, Intel’s 18A process is making the inroads IDM 2.0 is all about.
With a focus on high transistor density and improved power efficiency, the 18A process positions Intel to compete with the 5nm and 4nm processes used by Samsung and the Taiwan Semiconductor Manufacturing Company (TSMC).
As Intel ramps up production of the new semiconductors, other chip makers will be paying close attention. And for other fabless chipmakers like AMD, the 18A process could offer a compelling alternative to existing solutions.
However, Samsung and TSMC aren’t resting on their laurels either. Both foundries have started manufacturing more advanced 3nm chips and expect to launch the first 2nm chips later this year.
With 18A finally attracting attention from chip designers, it may be too late to save Intel’s struggling foundry business.
As reported by CNBC, the unit cost the chipmaker roughly $25 billion in each of the past two years. Intel’s own forecasts project the foundry to continue losing money until around 2030.
After an abysmal 2024, Intel shareholders have increasingly pushed for the company to spin off its contract manufacturing arm. And without former CEO and IDM 2.0 champion Pat Gelsinger to defend the project, potential buyers have started to circle.
According to the latest rumors, TSMC could acquire Intel’s manufacturing facilities, with Broadcom stepping in to buy the design business.
If such a deal goes through, TSMC would presumably acquire the rights to the 18A process, cementing its position as the market leader and consolidating the world’s most advanced chipmaking technologies under a single company.